Skip to main content

Metal Filling Styles

Metal Filling:


Whether performed by the designer or by the foundry, metal fill is a mandatory step at advanced nodes to ensure manufacturability and high yield. It involves filling the empty or white spaces near the design with metal polygons to ensure regular planarization of the wafer. Foundry-mandated fill requirements stipulate that the fill density be within specified maximum and minimum parameters.

While regular planarization is crucial to prevent over or under polishing of signal routes and active circuitry, metal fill can also negatively affect timing due to increased capacitive coupling to the nearby nets. Thus, the designer must ensure that the metal fill is done without impacting timing-critical nets. In other words, the fill needs to be timing-aware. Timing-awareness is also needed when the engineering change order (ECO) arrives late in the design cycle. The ECOs require the designer to change the layout and fill around the affected area. Thus, the fill methodology should allow easy removal and re-insertion of fill without violating timing of the nearby nets.

To optimally fill the design while minimizing the capacitive coupling, foundries have responded with increasingly sophisticated requirements to achieve the requisite fill density. As an example, while the place-and-route guided track-based fill on the left of Figure 1 can potentially cause higher capacitive coupling with the adjacent signal nets, the physical verification guided staggered and signoff fill pattern on the right delivers better white space coverage while reducing capacitive coupling. Since the staggered fill is coded as signoff requirements in a physical verification runset, the resulting fill from such runsets can be called signoff metal fill.



For advanced nodes, it is also necessary for metal-fill methodology to support large hierarchical designs to enable higher productivity. Such designs can be efficiently verified with an easy way to skip re-filling a pre-filled block since, in a typical design flow, the designer utilizes pre-filled blocks supplied by IP and core providers. These providers have already carefully closed timing after metal fill insertion.

Comments

Popular posts from this blog

Special cells and their Importance

Types of cells: Well taps (Tap Cells):  This is non-logic cells. Tap cells are needed to reduce substrate and well resistance to prevent latch up. These cells generally used when the all the standard or most of the cells does not have well or substrate. - It is inserted at specific interval in the design and distance is defined as per foundry rule for specific technology.  -We can insert at every row, every other row or stagger patterns also. - Most preferable way to insert the well tap is to stagger way because of reduce the total number of cells insertion in the design and reduce the total area utilization by those tap cells.  End cap Cells:   -This are the preplaced physical only cells. -Insert to meet certain design rules -Insert at the end of the site row, top and bottom side of the block boundary and every macro boundary.  - This will also helps to reduce the drc's nearer to macros as the standard cells do not placed near to the macros...

PD Interview Questions with Answers

PD Interview Questions with Answers: 1) How can you reduce dynamic power? – Reduce switching activity by designing good RTL - Clock gating -Architectural improvements -Reduce supply voltage -Use multiple voltage domains-Multi vdd 2) What are the vectors of dynamic power? Voltage and Current 3) How will you do power planning? 4) If you have both IR drop and congestion how will you fix it? -Spread macros -Spread standard cells -Increase strap width -Increase number of straps -Use proper blockage 5) Is increasing power line width and providing more number of straps are the only solution to IR drop? -Spread macros -Spread standard cells -Use proper blockage 6) In a reg to reg path if you have setup problem where will you insert buffer-near to launching flop or capture flop? Why? (buffers are inserted for fixing fanout voilations and hence they reduce setup voilation; otherwise we try to fix setup voilation with the sizing of cells; now just assume that you m...

Standard cells placement

Placement stage during PnR: As a basic function of placement stage is the placement of standard cells and their legalization based on certain factors. once floorplan/powerplan stage is ready then block owners need to check certain sanity checks like macro placement is proper or not, it is violating the macro spacing guidelines or not, special cells placed proper or not, port placement proper or not, power plan with all the layers incorporate in the design or not and so on. There are many other checks required to check before move to the placement stage.  Placement stage followed by the floorplan stage.We have to set many variables related to timing/congestion analysis effort at internal stage of placement step and so on, which are depends on block complexity and user requirement. For example, if the design is critical in terms of timing, then users can set the timing optimization efforts to high from medium, so at the time of placement optimization, tool can more focus to timing an...