Floorplan: Floor planing is the starting step in ASIC physical design. For example, before building the house, planning for the exact location of each end every room is similar to the ASIC’s floor planning process. Building’s blue-print planning will be a better example for ASIC floor planning. Detailed process of floor planning is explained below with necessary diagrams. Floor plan determines the size of the design cell (or die), creates the boundary and core area, and creates wire tracks for placement of standard cells. It is also a process of positioning blocks or macros on the die. First step is to define the total size of the die. Two types of design are possible. Block level designs will be rectilinear and chip level designs will be rectangular in shape. Rectilinear – To define this size more coordinates are required Rectangular – To define this only height and width of the die is required The following parameters are decided in the floor planning stage. Die si...
As we are moving towards the lower geometry from 45nm-28nm-16nm-7nm and so on, difficulties increasing in all the PPA aspects. This blogs will give you some idea about the PnR challenges and sign off challenges in lower geometry and ways to overcome those challenges.